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R1LP0108ESF-5SI#S1 - Renesas Electronics

Description: The R1LP0108E Series is a family of low voltage 1-Mbit static RAMs organized as 131, 072-word by 8-bit, fabricated by Renesas’s high-performance 0. 15um CMOS and TFT technologies. The R1LP0108E Series has realized higher density, higher performance and low power consumption. The R1LP0108E Series is suitable for memory applications where a simple interfacing, battery operating and battery backup are the important design objectives. It has been packaged in 32-pin SOP, 32-pin TSOP and 32-pin sTSOP.

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R1LP0108ESF-5SI#S1 - Renesas Electronics - PCB symbol
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R1LP0108ESF-5SI#S1 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PTSA0032KH-A
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R1LP0108ESF-5SI#S1 - Renesas Electronics - 3D model - Small Outline Packages - PTSA0032KH-A
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R1LP0108ESF-5SI#S1 Details

  • Manufacturer Part Number:

    R1LP0108ESF-5SI#S1

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP(32)

  • Pin Count:

    32

  • Manufacturer Package Code:

    PTSA0032KH

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    55 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PDSO-G32

  • Memory Density:

    1048576 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX8

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    EMBOSSED TAPE

  • Parallel/Serial:

    PARALLEL

  • Standby Current-Max:

    0.00001 A

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

R1LP0108ESF-5SI#S1 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 4-layer PCB with a solid ground plane, and to place thermal vias under the package to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow the recommended operating conditions, use a heat sink if necessary, and implement thermal monitoring and shutdown mechanisms to prevent overheating.
  • When handling the device, it is recommended to follow standard ESD precautions, such as using an ESD wrist strap, working on an ESD mat, and storing the device in an anti-static bag or container.
  • The R1LP0108ESF-5SI#S1 is not specifically designed for radiation-intensive environments. If you need to use the device in such an environment, it is recommended to consult with Renesas Electronics Corporation or a qualified radiation expert to assess the device's suitability.
  • The recommended soldering conditions for the R1LP0108ESF-5SI#S1 are a peak temperature of 260°C, with a soldering time of 10-30 seconds. For rework, it is recommended to use a low-temperature soldering iron and to follow the manufacturer's rework guidelines.

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R1LP0108ESF-5SI#S1 Overview

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