RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
Yes, the R1S-0509/HP is designed to withstand high vibrations. It has been tested to meet the IEC 60068-2-6 standard for vibration resistance. However, it's recommended to consult with RECOM's application engineers to ensure the module meets the specific vibration requirements of your application.
To ensure reliability in high-temperature environments, it's essential to follow RECOM's derating guidelines for temperature. The module's output power should be derated by 2.5% per degree Celsius above 40°C. Additionally, ensure good airflow around the module and avoid exceeding the maximum junction temperature of 125°C.
RECOM recommends using a low-ESR input capacitor with a value of 10-22 μF, X7R or X5R dielectric, and a voltage rating of 50-100 V. The capacitor should be placed as close as possible to the module's input pins to minimize noise and ripple.
Yes, multiple R1S-0509/HP modules can be paralleled to increase output power. However, it's essential to ensure that the modules are identical and have the same output voltage and current ratings. Additionally, a current-sharing scheme should be implemented to ensure equal current distribution among the modules.
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