RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
Yes, the R1S-2415 is designed to withstand high-vibration environments. However, it's recommended to follow the recommended PCB layout and mounting guidelines to ensure the module is securely attached to the PCB. Additionally, the module's thermal interface material should be suitable for high-vibration applications.
The R1S-2415 meets various safety certifications, including UL, EN, and IEC. To ensure compliance, follow the recommended application notes and guidelines provided by RECOM, and consult with a qualified safety engineer to ensure the module is used within its specified ratings and guidelines.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, depending on the input voltage and ripple current requirements. The capacitor should be placed as close as possible to the module's input pins to minimize noise and ensure stable operation.
Yes, multiple R1S-2415 modules can be paralleled to increase the output power. However, it's essential to follow RECOM's guidelines for paralleling modules, including using identical modules, ensuring identical input and output connections, and providing adequate heat sinking and thermal management.
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R1S-2415 Overview
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