RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
Yes, the R2S-0505/HP-R is designed to withstand high vibrations. It meets the IEC 60068-2-6 standard for vibration resistance, which includes sinusoidal vibration testing at 10-2000 Hz, 2G amplitude, and random vibration testing at 10-2000 Hz, 4G RMS.
To ensure reliability in high-temperature environments, RECOM recommends derating the module's output power according to the temperature derating curve provided in the datasheet. Additionally, ensuring good airflow and using a heat sink can help to reduce the module's operating temperature.
RECOM recommends using a low-ESR input capacitor with a value of 10-22 μF, X7R or X5R dielectric, and a voltage rating of at least 50V. The capacitor should be placed as close as possible to the module's input pins.
Yes, the R2S-0505/HP-R can be used in a redundant configuration to achieve high reliability. RECOM recommends using a redundant architecture with diode ORing or active ORing to ensure that the output voltage remains stable even in the event of a module failure.
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R2S-0505/HP-R Overview
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