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R5F104BDAFP#30 - Renesas Electronics

Description: RL78/G14 microcontrollers balance the industry's lowest level of consumption current (CPU: 66 μA/MHz, standby (STOP): 240 nA) and a high calculation performance of51.2 DMIPS (32 MHz). The built-in high-function timer supports three-phase motor control using three-phase complementary PWM output. They have an on-chip oscillator, data flash, A/D and D/A converters, comparator, and more. Built-in safety features (function that detects illegal operation of hardware) enable support for the household appliance saf

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R5F104BDAFP#30 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - 32-Pin LQFP
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R5F104BDAFP#30 - Renesas Electronics  - 3D model - Quad Flat Packages - 32-Pin LQFP
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R5F104BDAFP#30 Details

  • Manufacturer Part Number:

    R5F104BDAFP#30

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LQFP

  • Package Description:

    LQFP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    PLQP0032GB

  • HTS Code:

    8542.31.00.20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    OPERATES AT 1.6 V MINIMUM SUPPLY AT 4 MHz

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    RL78

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G32

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of External Interrupts:

    12

  • Number of I/O Lines:

    28

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    32

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • RAM (bytes):

    5632

  • ROM (words):

    49152

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    8.7 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F104BDAFP#30 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VCC first, followed by VDD, and then the clock signal. This ensures proper initialization of the internal voltage regulators and prevents latch-up.
  • It is recommended to tri-state the JTAG pins during power-down or reset to prevent unwanted data corruption or bus contention. This can be done by setting the JTAG pins as inputs or using an external buffer to isolate the JTAG interface.
  • The maximum allowed clock skew is typically specified as 1-2 clock cycles, depending on the specific peripheral and system requirements. Excessive clock skew can cause data corruption or synchronization issues.
  • To optimize flash memory programming time, use the fastest available clock frequency, enable the flash accelerator (if available), and use a programming algorithm that minimizes the number of erase and write cycles. Additionally, consider using a flash memory controller with a high-speed interface, such as QSPI or HyperBus.
  • The R5F104BDAFP#30 has a maximum junction temperature (TJ) of 150°C. To ensure reliable operation, it is essential to provide adequate heat dissipation, such as using a heat sink or thermal pad, and to avoid exposing the device to high ambient temperatures or thermal gradients.

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R5F104BDAFP#30 Overview

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