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R5F109ABKSP#X0 - Renesas Electronics

Description: RL78/F12 microcontrollers are available in a 20 to 64-pin, 8 to 64 KB flash memory lineup, and realize the industry's lowest level of consumption current. They have a built-in LIN module as an automotive interface. With various built-in functions for realizing functional safety including flash memory CRC calculation, illegal memory access detection, RAM guard, A/D converter testing, and SFR guard, a highly reliable system can be built, so these microcontrollers can be used for industrial applications and of

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R5F109ABKSP#X0 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PLSP0030JB-A
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R5F109ABKSP#X0 - Renesas Electronics  - 3D model - Small Outline Packages - PLSP0030JB-A
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R5F109ABKSP#X0 Details

  • Manufacturer Part Number:

    R5F109ABKSP#X0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LSSOP

  • Package Description:

    SSOP-30

  • Pin Count:

    30

  • Manufacturer Package Code:

    PLSP0030JB

  • HTS Code:

    8542.31.00.20

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    RL78

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDSO-G30

  • Length:

    9.85 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    2

  • Number of External Interrupts:

    6

  • Number of I/O Lines:

    26

  • Number of Serial I/Os:

    5

  • Number of Terminals:

    30

  • Number of Timers:

    10

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP30,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • RAM (bytes):

    1536

  • ROM (words):

    24576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.4 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    8.2 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    6.1 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

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R5F109ABKSP#X0 Overview

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