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R5F109ACKSP#X0G - Renesas Electronics

Description: RL78/F12 microcontrollers are available in a 20 to 64-pin, 8 to 64 KB flash memory lineup, and realize the industry's lowest level of consumption current. They have a built-in LIN module as an automotive interface. With various built-in functions for realizing functional safety including flash memory CRC calculation, illegal memory access detection, RAM guard, A/D converter testing, and SFR guard, a highly reliable system can be built, so these microcontrollers can be used for industrial applications and of

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R5F109ACKSP#X0G - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - ***30-PIN PLASTIC SSOP (7.62 mm (300))_
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R5F109ACKSP#X0G - Renesas Electronics  - 3D model - Small Outline Packages - ***30-PIN PLASTIC SSOP (7.62 mm (300))_
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R5F109ACKSP#X0G Details

  • Manufacturer Part Number:

    R5F109ACKSP#X0G

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LSSOP

  • Package Description:

    SSOP-30

  • Pin Count:

    30

  • Manufacturer Package Code:

    PLSP0030JB

  • HTS Code:

    8542.31.00.20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Has ADC:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    RL78

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDSO-G30

  • Length:

    9.85 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    2

  • Number of External Interrupts:

    6

  • Number of I/O Lines:

    26

  • Number of Serial I/Os:

    5

  • Number of Terminals:

    30

  • Number of Timers:

    10

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP30,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (bytes):

    2048

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.4 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    8.2 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    6.1 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F109ACKSP#X0G Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VCC first, followed by VDD, and then the clock signal. This ensures proper initialization of the internal voltage regulators and prevents latch-up.
  • The clock settings can be configured using the Clock Control Register (CCR) and the Clock Source Select Register (CSSR). The CCR sets the clock frequency, while the CSSR selects the clock source (e.g., internal oscillator, external crystal, or external clock).
  • The maximum operating frequency of the R5F109ACKSP#X0G is 32 MHz, but it can be overclocked to 40 MHz with reduced voltage and temperature ranges.
  • The ADC can be configured using the ADC Control Register (ADCCR) and the ADC Channel Select Register (ADCSR). The ADCCR sets the ADC mode, while the ADCSR selects the analog input channel. The ADC conversion result is stored in the ADC Data Register (ADDR).
  • The VBAT pin is used to connect a battery or a supercapacitor to store data in the backup registers during power-down mode. This allows the microcontroller to retain its state even when the main power supply is turned off.

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