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R5F56307DDFP#V0 - Renesas Electronics

Description: With flash memory capacities from small to large and package pin counts from low to high, the RX630 Group can satisfy the demands of a variety of embedded devices. All the products of the RX630 Group are equipped with E2 data flash capable of 100, 000 rewrites and enhanced peripheral functions with increased numbers of channels including timers, USB 2.0 function module, serial communication interface, I2C bus interface, CAN, 10-bit and 12-bit A/D converter, and 10-bit D/A converter. In particular, built-in

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R5F56307DDFP#V0 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - P-LFQFP100-14x14-0.50-1
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R5F56307DDFP#V0 Details

  • Manufacturer Part Number:

    R5F56307DDFP#V0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    LQFP

  • Package Description:

    14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    PLQP0100KB

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    3

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    RX

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    79

  • Number of Terminals:

    100

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    65536

  • ROM (words):

    393216

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    100 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F56307DDFP#V0 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VCC first, followed by VCCIO, and then the clock signal. This ensures proper initialization of the device.
  • The clock settings can be configured using the Clock Control Register (CCR). The CCR allows you to select the clock source, divide the clock frequency, and enable or disable the clock output.
  • The maximum operating temperature range for the R5F56307DDFP is -40°C to 125°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • The R5F56307DDFP has a built-in watchdog timer that can be enabled and configured using the Watchdog Timer Control Register (WTCR). The watchdog timer can be used to reset the device in case of a software fault or hang-up.
  • The maximum current consumption of the R5F56307DDFP depends on the operating frequency and voltage. According to the datasheet, the maximum current consumption is approximately 350 mA at 3.3 V and 100 MHz operating frequency.

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