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R5F563NADDFP#V0 - Renesas Electronics

Description: RX63N Group microcontrollers come in a comprehensive memory vs. package lineup to suit your system scale. In addition to standard functions such as 12-bit A/D converter, motor control timers, SCI, RSPI, I2C, CAN, and safety features, connectivity functions such as Ethernet and USB host have been enhanced. The lineup also includes products possessing specialized functions, such as sensing/image display using a CMOS camera, or security (hardware AES encryption). Products that support high-temperature (105°C)

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R5F563NADDFP#V0 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0100KB-A
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R5F563NADDFP#V0 - Renesas Electronics  - 3D model - Quad Flat Packages - PLQP0100KB-A
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R5F563NADDFP#V0 Details

  • Manufacturer Part Number:

    R5F563NADDFP#V0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    LQFP

  • Package Description:

    LQFP-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    PLQP0100KB

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    3

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    RX

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    6

  • Number of I/O Lines:

    79

  • Number of Terminals:

    100

  • Number of Timers:

    20

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    131072

  • ROM (words):

    786432

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    100 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F563NADDFP#V0 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VCC first, followed by VDD, and then the clock signal. This ensures proper initialization of the device.
  • To optimize power consumption, use the low-power modes (e.g., sleep, standby) when the device is not actively processing data. Additionally, adjust the clock frequency and voltage levels according to the application's requirements.
  • The maximum operating temperature range for the R5F563NADDFP is -40°C to 125°C. However, it's recommended to operate the device within the industrial temperature range (-40°C to 85°C) for optimal performance and reliability.
  • While the R5F563NADDFP is designed to operate in industrial environments, it's essential to take additional precautions when using it in harsh environments with high humidity and vibration. Ensure proper sealing, conformal coating, and mechanical fixation to prevent damage and ensure reliable operation.
  • To troubleshoot issues with the flash memory, check the programming algorithm, verify the flash memory configuration, and ensure that the device is properly powered. Also, consult the Renesas Electronics Corporation's application notes and technical support resources for guidance.

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