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R5F563NEDDBG#U0 - Renesas Electronics

Description: RX63N Group microcontrollers come in a comprehensive memory vs. package lineup to suit your system scale. In addition to standard functions such as 12-bit A/D converter, motor control timers, SCI, RSPI, I2C, CAN, and safety features, connectivity functions such as Ethernet and USB host have been enhanced. The lineup also includes products possessing specialized functions, such as sensing/image display using a CMOS camera, or security (hardware AES encryption). Products that support high-temperature (105°C)

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R5F563NEDDBG#U0 - Renesas Electronics PCB footprint - BGA - BGA - PLBG0176GA-A (176-Pin BGA)
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R5F563NEDDBG#U0 - Renesas Electronics  - 3D model - BGA - PLBG0176GA-A (176-Pin BGA)
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R5F563NEDDBG#U0 Details

  • Manufacturer Part Number:

    R5F563NEDDBG#U0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    LFBGA

  • Package Description:

    13 X 13 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, LFBGA-176

  • Pin Count:

    176

  • Manufacturer Package Code:

    PLBG0176GA

  • Similar Group:

    MC001002118710811458

  • Country Of Origin:

    Japan

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    3

  • Has ADC:

    YES

  • Address Bus Width:

    32

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    RX

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PBGA-B176

  • Length:

    13 mm

  • Number of DMA Channels:

    6

  • Number of I/O Lines:

    134

  • Number of Terminals:

    176

  • Number of Timers:

    26

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA176,15X15,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    131072

  • ROM (words):

    2097152

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.4 mm

  • Speed:

    100 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F563NEDDBG#U0 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VCC first, followed by VCC_CORE, and then the clock signal. This ensures proper initialization of the device.
  • The clock settings can be configured using the Clock Control Register (CCR). The CCR register allows you to select the clock source, divide the clock frequency, and enable or disable the clock output.
  • The NMI (Non-Maskable Interrupt) pin is used to generate a non-maskable interrupt request to the CPU. This pin is typically used to signal a critical event, such as a watchdog timer expiration or a power failure.
  • The R5F563NEDDBG#U0 has a built-in watchdog timer (WDT) that can be enabled and configured using the Watchdog Timer Control Register (WTCR). The WDT can be used to reset the device in case of a software fault or hang-up.
  • The maximum operating frequency of the R5F563NEDDBG#U0 is 32 MHz, but it can be overclocked up to 40 MHz with reduced voltage and temperature ranges.

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R5F563NEDDBG#U0 Overview

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