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R5F563NYDDFC#V0 - Renesas Electronics

Description: RX63N Group microcontrollers come in a comprehensive memory vs. package lineup to suit your system scale. In addition to standard functions such as 12-bit A/D converter, motor control timers, SCI, RSPI, I2C, CAN, and safety features, connectivity functions such as Ethernet and USB host have been enhanced. The lineup also includes products possessing specialized functions, such as sensing/image display using a CMOS camera, or security (hardware AES encryption). Products that support high-temperature (105°C)

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R5F563NYDDFC#V0 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - P-LFQFP176-24x24-0.50
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R5F563NYDDFC#V0 Details

  • Manufacturer Part Number:

    R5F563NYDDFC#V0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    LQFP

  • Package Description:

    LQFP-176

  • Pin Count:

    176

  • Manufacturer Package Code:

    PLQP0176KB

  • Country Of Origin:

    Japan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    RX

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G176

  • Length:

    24 mm

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    6

  • Number of I/O Lines:

    134

  • Number of Terminals:

    176

  • Number of Timers:

    26

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    262144

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    100 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    24 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F563NYDDFC#V0 Frequently Asked Questions (FAQs)

  • The recommended oscillator frequency for the R5F563NYDDFC#V0 is 32.768 kHz for the low-speed oscillator (LOSC) and 12 MHz to 24 MHz for the high-speed oscillator (HOSC).
  • The clock settings can be configured using the Clock Generator (CG) module. The CG module allows you to select the clock source, divide the clock frequency, and enable/disable the clock output. Refer to the Renesas documentation and application notes for specific configuration details.
  • The maximum operating temperature range for the R5F563NYDDFC#V0 is -40°C to +85°C. However, it's recommended to operate the device within the specified temperature range for optimal performance and reliability.
  • The R5F563NYDDFC#V0 has several power-saving modes, including Sleep, Stop, and Hibernate modes. These modes can be implemented using the Power Management (PM) module. Refer to the Renesas documentation and application notes for specific implementation details.
  • The maximum current consumption of the R5F563NYDDFC#V0 varies depending on the operating mode and frequency. According to the datasheet, the maximum current consumption is approximately 350 mA at 24 MHz with all peripherals enabled.

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R5F563NYDDFC#V0 Overview

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