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R5F564MLDDBG#V1 - Renesas Electronics

Description: 120-MHz 32-bit RX MCU, on-chip FPU, 240 DMIPS, up to 4-MB flash memory, 512-KB SRAM, various communications interfaces including IEEE 1588-compliant Ethernet MAC, full-speed USB 2.0 with battery charging, SD host interface (optional), quad SPI, and CAN, 12-bit A/D converter, RTC, encryption (optional), serial interface for audio, CMOS camera interface

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PCB Footprints
R5F564MLDDBG#V1 - Renesas Electronics PCB footprint - BGA - BGA - PLBG0176GA-A
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3D Models
R5F564MLDDBG#V1 - Renesas Electronics  - 3D model - BGA - PLBG0176GA-A
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R5F564MLDDBG#V1 Details

  • Manufacturer Part Number:

    R5F564MLDDBG#V1

  • Brand Name:

    Renesas

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LFBGA

  • Package Description:

    LFBGA-176

  • Pin Count:

    176

  • Manufacturer Package Code:

    PLBG0176GE

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7.97

  • Has ADC:

    YES

  • Additional Feature:

    2 EXTERNAL DMA CHANNEL AVAILABLE

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    RX64M

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PBGA-B176

  • Length:

    13 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    8

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    128

  • Number of Serial I/Os:

    18

  • Number of Terminals:

    176

  • Number of Timers:

    23

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA176,15X15,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (bytes):

    524288

  • ROM (words):

    4194304

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.4 mm

  • Speed:

    120 MHz

  • Supply Current-Max:

    110 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

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R5F564MLDDBG#V1 Overview

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Part Image R5F564MLDDBG Renesas Electronics Corporation

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