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R5F5671CDDFB#30 - Renesas Electronics

Description: The RX671 group microcontrollers deliver superior real-time performance with the RXv3 core running at 120MHz. The HMI functions enable contactless operation by proximity switches and voice recognition, making it possible to realize hygienic HMI suitable for the new normal. A wide variety of packages, including the 4.5mm x 4.5mm 64-pin TFBGA, is all equipped with 2MB flash memory and 384KB SRAM to meet a wide range of needs with a single chip.

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R5F5671CDDFB#30 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0144KA-B 2021
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R5F5671CDDFB#30 - Renesas Electronics  - 3D model - Quad Flat Packages - PLQP0144KA-B 2021
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R5F5671CDDFB#30 Details

  • Manufacturer Part Number:

    R5F5671CDDFB#30

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LFQFP

  • Pin Count:

    144

  • Manufacturer Package Code:

    PLQP0144KA

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    12

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    RX671

  • Clock Frequency-Max:

    30 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • Format:

    FLOATING-POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • Length:

    20 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    10

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    114

  • Number of Serial I/Os:

    16

  • Number of Terminals:

    144

  • Number of Timers:

    19

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.86SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    393216

  • ROM (words):

    1572864

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    120 MHz

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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System Verified
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Sponsored

R5F5671CDDFB#30 Overview

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Part Image R5F5671CDDFB Renesas Electronics Corporation

Microcontroller, 32-Bit, FLASH, RXV3 CPU, 120MHz, CMOS, PQFP144

Part Image R5F5671CDGFB Renesas Electronics Corporation

Microcontroller, 32-Bit, FLASH, RXV3 CPU, 120MHz, CMOS, PQFP144

Part Image R5F5671CDDFB#10 Renesas Electronics Corporation

Microcontroller, 32-Bit, FLASH, RX671 CPU, 120MHz, CMOS, PQFP144

Part Image R5F5671CDGFB#10 Renesas Electronics Corporation

Microcontroller, 32-Bit, FLASH, RX671 CPU, 120MHz, CMOS, PQFP144