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R5F572NNDDBD#20 - Renesas Electronics

Description: The RX72N Group microcontrollers are equipped with the third-generation RX CPU core, the RXv3 core, and these high-performance products operate at 240MHz. Real-time control and networking of equipment are realized with a single chip with 4MB flash memory capable of read operations at 120MHz, 1MB of SRAM and 182 general-purpose I/O ports. The device also supports high-end HMI functionality for advanced display capability. The device also has complete security capability, vital for industrial and consumer equ

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R5F572NNDDBD#20 - Renesas Electronics PCB footprint - BGA - BGA - PLBG0224GA-A-2021
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R5F572NNDDBD#20 - Renesas Electronics  - 3D model - BGA - PLBG0224GA-A-2021
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R5F572NNDDBD#20 Details

  • Manufacturer Part Number:

    R5F572NNDDBD#20

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LFBGA

  • Package Description:

    LFBGA-224

  • Pin Count:

    224

  • Manufacturer Package Code:

    PLBG0224GA

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    RXV3

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B224

  • Length:

    13 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    10

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    183

  • Number of Serial I/Os:

    16

  • Number of Terminals:

    224

  • Number of Timers:

    29

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA224,15X15,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    1048576

  • ROM (words):

    4194304

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.4 mm

  • Speed:

    240 MHz

  • Supply Current-Max:

    261 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

R5F572NNDDBD#20 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to first apply the power supply voltage (VCC) and then the clock signal (CLK). This ensures that the internal voltage regulators and clock circuits are properly initialized.
  • The clock settings can be configured through the Clock Control Register (CCR) and the PLL Control Register (PCR). The CCR sets the clock source and frequency, while the PCR configures the PLL settings. Refer to the user manual for detailed instructions.
  • The maximum operating temperature range for the R5F572NNDDBD#20 is -40°C to 125°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • The R5F572NNDDBD#20 has a built-in watchdog timer (WDT) that can be enabled and configured through the Watchdog Timer Control Register (WTCR). The WDT can be set to reset the device or generate an interrupt upon timeout.
  • The maximum current consumption of the R5F572NNDDBD#20 depends on the operating frequency and voltage. According to the datasheet, the maximum current consumption is approximately 350mA at 100MHz and 3.3V.

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