R6018JNXC7G - ROHM Semiconductor

R6018JNXC7G Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
• How do I ensure stable operation with a high-ESR output capacitor?
  To ensure stable operation with a high-ESR output capacitor, ROHM recommends adding a 1nF to 10nF ceramic capacitor in parallel with the output capacitor to reduce the overall ESR. Additionally, the output capacitor should be placed close to the IC to minimize parasitic inductance.
• What is the maximum allowed voltage on the EN pin?
  The maximum allowed voltage on the EN pin is 6V, which is the same as the maximum input voltage of the device. Applying a voltage higher than 6V on the EN pin can cause damage to the internal circuitry.
• Can I use a lower value for the input capacitor (CIN) than recommended?
  While it's possible to use a lower value for the input capacitor, ROHM recommends following the recommended value to ensure stable operation and minimize the risk of oscillation. A lower value may lead to instability or reduced performance.
• How do I handle the power-on reset (POR) function during power-up?
  The R6018JNXC7G has a built-in POR function that resets the internal circuitry during power-up. To handle the POR function, ensure that the input voltage rises slowly (typically 10ms to 100ms) to allow the POR circuit to stabilize before the device becomes active.