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R7FA4E10B2CNE#BA0 - Renesas Electronics

Description: The Renesas RA4E1 group of 32-bit microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M33 core with TrustZone. The RA4E1 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP) —and is the perfect entry point into the RA Family of microcontrollers. The RA4E1 is suitable for entry IoT applications requiring value optimized feature and connectivity integration, total system cost reduction and an optimized mixture of

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R7FA4E10B2CNE#BA0 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - PWQN0048KC-A-2022
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R7FA4E10B2CNE#BA0 - Renesas Electronics  - 3D model - Quad Flat No-Lead - PWQN0048KC-A-2022
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R7FA4E10B2CNE#BA0 Details

  • Manufacturer Part Number:

    R7FA4E10B2CNE#BA0

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    10

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M33

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-XQCC-N48

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    8

  • Number of External Interrupts:

    11

  • Number of I/O Lines:

    30

  • Number of Serial I/Os:

    5

  • Number of Terminals:

    48

  • Number of Timers:

    10

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.27SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • RAM (bytes):

    131072

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.8 mm

  • Speed:

    100 MHz

  • Supply Current-Max:

    65 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

R7FA4E10B2CNE#BA0 Overview

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