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R7FA6M2AF3CFP#HA0 - Renesas Electronics

Description: The Renesas RA6M2 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers Ethernet MAC with individual DMA, to ensure high data throughput. The RA6M2 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M2 is suitable for IoT applications requiring Ethernet, security, large embedded RAM, and low active power c

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R7FA6M2AF3CFP#HA0 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0100KB-B
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R7FA6M2AF3CFP#HA0 Details

  • Manufacturer Part Number:

    R7FA6M2AF3CFP#HA0

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • Has ADC:

    YES

  • Address Bus Width:

    21

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • Format:

    FLOATING-POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    8

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    76

  • Number of Serial I/Os:

    11

  • Number of Terminals:

    100

  • Number of Timers:

    16

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (bytes):

    393216

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    120 MHz

  • Supply Current-Max:

    102 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

R7FA6M2AF3CFP#HA0 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the R7FA6M2AF3CFP#HA0 is -40°C to +85°C.
  • The clock settings for the R7FA6M2AF3CFP#HA0 can be configured using the System Clock Control Register (SCKCR) and the Clock Control Register (CKCR). Refer to the datasheet and the Renesas RA Family Software Package for more information.
  • The maximum frequency of the R7FA6M2AF3CFP#HA0's CPU is 240 MHz.
  • The R7FA6M2AF3CFP#HA0's built-in flash memory can be used for storing program code and data. The flash memory can be accessed using the Flash Memory Interface (FMI) and the Flash Memory Control Register (FMCR). Refer to the datasheet and the Renesas RA Family Software Package for more information.
  • The power consumption of the R7FA6M2AF3CFP#HA0 varies depending on the operating mode and frequency. Refer to the datasheet for the typical power consumption values.

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R7FA6M2AF3CFP#HA0 Overview

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Part Image R7FA6M2AF3CFP#BA0 Renesas Electronics Corporation

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Part Image R7FA6M2AF3CFP#HC0 Renesas Electronics Corporation

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Part Image R7FA6M2AF3CFP Renesas Electronics Corporation

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Part Image R7FA6M2AF3CFP#AA1 Renesas Electronics Corporation

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Part Image R7FA6M2AF3CFP#AC0 Renesas Electronics Corporation

RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4 CPU, 120MHz, CMOS, PQFP100

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