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R7FA6T1AB3CFM#AA0 - Renesas Electronics

Description: The Renesas RA6T1 Group, as part of the wide scalable RA6 Series, is optimized for enhanced motor control. The RA6T1 is built on a highly efficient 40nm process and equipped with various peripherals and memory suitable for motor control applications. To make engineers' application design easy, RA6T1 is supported by the Flexible Software Package (FSP) including a motor control specific control code algorithm, which makes the RA6T1 a perfect choice for quick time to market.

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R7FA6T1AB3CFM#AA0 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0064KB-C
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R7FA6T1AB3CFM#AA0 - Renesas Electronics  - 3D model - Quad Flat Packages - PLQP0064KB-C
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R7FA6T1AB3CFM#AA0 Details

  • Manufacturer Part Number:

    R7FA6T1AB3CFM#AA0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LQFP

  • Pin Count:

    64

  • Manufacturer Package Code:

    PLQP0064KB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    13

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

R7FA6T1AB3CFM#AA0 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply the power supply voltage (VCC) first, followed by the clock signal (XIN). This ensures proper initialization of the internal voltage regulator and clock circuitry.
  • To optimize power consumption in low-power modes, use the built-in low-power modes (e.g., SLEEP, STOP, and HALT) and adjust the clock frequency, disable unnecessary peripherals, and use the internal voltage regulator's low-power mode.
  • The maximum allowed capacitance for the XIN pin is 20 pF. Exceeding this value may affect the oscillator's stability and startup time.
  • Yes, the R7FA6T1AB3CFM#AA0 is designed to operate in harsh environments, including high temperatures (up to 125°C) and high humidity. However, ensure proper PCB design, component selection, and thermal management to guarantee reliable operation.
  • Implement secure boot mechanisms by using the built-in cryptographic accelerators, secure boot ROM, and configuring the boot mode to use encrypted firmware images. Additionally, use secure key storage and implement secure firmware update mechanisms.

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R7FA6T1AB3CFM#AA0 Overview

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