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R7FS5D37A3A01CFM#HA0 - Renesas Electronics

Description: The S5D3 adds a new tier to the S5 MCU series for applications that require a high-performance Cortex M4F core at a very attractive price point, that does not require on-chip graphic acceleration or Ethernet connectivity. The S5D3 is built on a highly efficient 40nm process, offers enhanced security, wide connectivity and is fully supported by the Synergy Software Package (SSP).Synergy Software Package (SSP)Commercial software worth over $100K which is available to developers using the Synergy Platform for

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R7FS5D37A3A01CFM#HA0 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0064KB-C
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R7FS5D37A3A01CFM#HA0 Details

  • Manufacturer Part Number:

    R7FS5D37A3A01CFM#HA0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LQFP

  • Package Description:

    LQFP-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    PLQP0064KB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Has ADC:

    YES

  • Address Bus Width:

    13

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    8

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G64

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    8

  • Number of I/O Lines:

    40

  • Number of Serial I/Os:

    7

  • Number of Terminals:

    64

  • Number of Timers:

    13

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    262144

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    120 MHz

  • Supply Current-Max:

    87 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

R7FS5D37A3A01CFM#HA0 Overview

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