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R7S910035CBG#AC0 - Renesas Electronics

Description: The RZ/T1 Group has the Arm® Cortex®-R4 Processor with FPU core, which was designed for real-time processing, and is capable of high-speed operation at up to 600 MHz. Furthermore, access does not need to be performed via cache memory, and tightly-coupled memory capable of definitive real-time response processing is built-in, enabling high-speed access from the CPU without passing through the cache memory. RZ/T1 devices that are equipped with a built-in Renesas R-IN engine (“R-IN engine”), an accelerator for

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R7S910035CBG#AC0 - Renesas Electronics PCB footprint - BGA - BGA - PRBG0320GA-A
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R7S910035CBG#AC0 - Renesas Electronics  - 3D model - BGA - PRBG0320GA-A
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R7S910035CBG#AC0 Details

  • Manufacturer Part Number:

    R7S910035CBG#AC0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    FBGA

  • Package Description:

    FBGA-320

  • Pin Count:

    320

  • Manufacturer Package Code:

    PRBG0320GA

  • Country Of Origin:

    Japan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-R4

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B320

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    32

  • Number of External Interrupts:

    20

  • Number of Terminals:

    320

  • Number of Timers:

    33

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA320,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • ROM (words):

    0

  • ROM Programmability:

    ROM LESS

  • Seated Height-Max:

    1.75 mm

  • Speed:

    300 MHz

  • Supply Current-Max:

    629 mA

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

R7S910035CBG#AC0 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the R7S910035CBG#AC0 is -40°C to +85°C.
  • The clock settings for the R7S910035CBG#AC0 can be configured using the Clock Control Register (CCR) and the System Clock Control Register (SCCR). Refer to the datasheet for specific register settings and configuration options.
  • The maximum current consumption of the R7S910035CBG#AC0 is approximately 350 mA at 3.3V and 25°C, depending on the operating mode and peripheral usage.
  • The R7S910035CBG#AC0 has several low-power modes, including Sleep, Stop, and Hibernate modes. These modes can be entered by setting specific bits in the System Control Register (SCR) and Power Management Control Register (PMC). Refer to the datasheet for specific register settings and configuration options.
  • The maximum frequency of the R7S910035CBG#AC0 is 32 MHz, depending on the clock source and configuration.

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