Mitsubishi Electric recommends a 4-layer PCB with a thermal relief pattern on the bottom layer to dissipate heat. A minimum of 1 oz copper thickness is recommended. Additionally, a thermal pad on the bottom of the package should be connected to a heat sink or a thermal relief area on the PCB.
To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation of the RA18H1213G-101 according to the temperature derating curve provided in the datasheet. Additionally, a heat sink or thermal management system should be implemented to keep the junction temperature below 150°C.
Mitsubishi Electric recommends a peak soldering temperature of 260°C for a maximum of 10 seconds. The device should be soldered using a solder with a melting point of 217°C or higher. A soldering iron with a temperature control system is recommended to prevent overheating.
The RA18H1213G-101 is sensitive to electrostatic discharge. To prevent ESD damage, it is recommended to handle the device in an ESD-controlled environment, use ESD-protective packaging, and ensure that all equipment and personnel are grounded. Additionally, an ESD protection diode or network can be added to the PCB design.
The RA18H1213G-101 should be stored in a dry, cool place away from direct sunlight. The storage temperature should be between -40°C and 30°C, and the humidity should be below 60%. The device should be handled with care to prevent mechanical damage and electrostatic discharge.
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