RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a solid ground plane to reduce thermal resistance.
Yes, the RA3-122005D/SMD-R is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in industrial and transportation applications. However, it's recommended to follow proper mounting and soldering procedures to ensure reliable operation.
To ensure EMC, RECOM recommends following proper PCB layout and design guidelines, such as keeping sensitive analog circuits away from the DC-DC converter, using a common-mode choke, and adding EMI filters if necessary. Additionally, the module's metal case should be connected to a solid ground plane to reduce radiated emissions.
The maximum allowable capacitance on the output of the RA3-122005D/SMD-R is 2200uF. Exceeding this value may cause instability or oscillation in the output voltage. It's recommended to follow the recommended output capacitance values in the datasheet to ensure reliable operation.
Yes, the RA3-122005D/SMD-R can be used in a redundant or parallel configuration to increase power availability and reliability. However, it's recommended to follow proper design and layout guidelines to ensure reliable operation and to prevent unwanted interactions between modules.
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RA3-122005D/SMD-R Overview
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