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RAA230151GSB#HA0 - Renesas Electronics

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RAA230151GSB#HA0 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 8pin HLSOP
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RAA230151GSB#HA0 - Renesas Electronics  - 3D model - Small Outline Packages - 8pin HLSOP
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RAA230151GSB#HA0 Details

  • Manufacturer Part Number:

    RAA230151GSB#HA0

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HLSOP-8

  • Manufacturer Package Code:

    PLSP0008DB

  • ECCN Code:

    5A002

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    PULSE FREQUENCY MODULATION TECHNIQUE ALSO AVAILABLE

  • Analog IC - Other Type:

    BATTERY CHARGE CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    28 V

  • Input Voltage-Min:

    7 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.93 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.23

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Seated Height-Max:

    1.68 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1100 kHz

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.94 mm

RAA230151GSB#HA0 Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide for the RAA230151GSB, which includes recommendations for PCB layout, thermal management, and heat sink design. It's essential to follow these guidelines to ensure optimal performance, thermal stability, and reliability.
  • The RAA230151GSB has built-in overcurrent protection and fault detection features. However, to implement these features, you need to connect the OCP (Overcurrent Protection) pin to a suitable resistor and capacitor network, and monitor the FLT (Fault) pin for fault detection. Renesas provides application notes and design guides that explain the implementation details.
  • The input capacitor selection and placement are critical for the RAA230151GSB's performance and stability. Renesas recommends using a low-ESR capacitor with a value between 10uF to 22uF, placed as close as possible to the VIN pin. The capacitor should be rated for the maximum input voltage and have a suitable temperature rating.
  • The switching frequency and dead time of the RAA230151GSB can be optimized for specific applications by adjusting the RT (Oscillator Timing) pin and the DT (Dead Time) pin. Renesas provides guidelines and equations in the datasheet to help optimize these parameters. Additionally, simulation tools and application notes can provide further guidance.
  • For high-power applications, thermal design is critical to ensure the RAA230151GSB's reliability and performance. Renesas recommends using a heat sink with a thermal resistance of less than 10°C/W, and ensuring good airflow around the device. The PCB design should also consider thermal vias, thermal layers, and heat spreaders to dissipate heat effectively.

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RAA230151GSB#HA0 Overview

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