RAC01-09SC - RECOM Power

RAC01-09SC Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
• Can I use this module in a high-vibration environment?
  Yes, the RAC01-09SC is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in industrial and transportation applications. However, it's essential to ensure proper mounting and screwing of the module to the PCB to prevent damage.
• How do I ensure electromagnetic compatibility (EMC) with this module?
  To ensure EMC, RECOM recommends using a shielded enclosure, keeping the module away from sensitive components, and using a common-mode choke or ferrite bead on the input lines. Additionally, the module's output should be decoupled with a capacitor to reduce electromagnetic radiation.
• What is the maximum allowed input capacitance for this module?
  The maximum allowed input capacitance for the RAC01-09SC is 47µF. Exceeding this value may cause instability or oscillation in the module. It's essential to follow the recommended input capacitor values and types to ensure reliable operation.
• Can I use this module in a redundant or parallel configuration?
  Yes, the RAC01-09SC can be used in a redundant or parallel configuration to achieve higher power ratings or redundancy. However, it's crucial to ensure proper synchronization and ORing of the outputs to prevent damage or instability.