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RAC02-12SGB - RECOM Power

Description: AC/DC Power Modules 2W 85-264Vin 12Vout 167mA

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PCB Footprints
RAC02-12SGB - RECOM Power PCB footprint - Other - Other - RAC02-12SGB-1
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3D Models
RAC02-12SGB - RECOM Power  - 3D model - Other - RAC02-12SGB-1
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RAC02-12SGB Details

  • Manufacturer Part Number:

    RAC02-12SGB

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    XMA,

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • Manufacturer:

    RECOM Power GmbH

  • YTEOL:

    6

  • Analog IC - Other Type:

    AC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    CE, EN, IEC, UL

  • Efficiency (Main Output):

    68%

  • Input Voltage-Max:

    264 V

  • Input Voltage-Min:

    85 V

  • Input Voltage-Nom:

    230 V

  • JESD-30 Code:

    R-XXMA-T4

  • Length:

    33.7 mm

  • Line Regulation-Max:

    2%

  • Load Regulation-Max:

    6%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    80 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Current-Max:

    0.167 A

  • Output Voltage-Max:

    12.72 V

  • Output Voltage-Min:

    11.28 V

  • Output Voltage-Nom:

    12 V

  • Package Body Material:

    PLASTIC

  • Package Code:

    XMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Protections:

    OVER CURRENT, OVER VOLTAGE, SHORT CIRCUIT PROTECTION

  • Ripple Voltage (Main Out):

    0.10605 Vrms

  • Screening Level:

    EN/IEC/UL 62368-1

  • Seated Height-Max:

    19.5 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    OTHER

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    UNSPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    2 W

  • Trim/Adjustable Output:

    NO

  • Warm-up Time:

    2 s

  • Width:

    22.2 mm

RAC02-12SGB Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the module on a multi-layer PCB with a large copper area for heat dissipation. The copper area should be connected to a solid ground plane to ensure good heat conduction.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C. Apply a small amount of solder paste to the PCB pads and place the module on top. Use a reflow oven or a hot air gun to melt the solder paste, and ensure the module is securely attached to the PCB.
  • The recommended input capacitor value is 10uF to 22uF, with a voltage rating of 25V or higher. A low-ESR ceramic capacitor, such as an X7R or X5R type, is recommended for optimal performance.
  • To protect the module from overvoltage and undervoltage conditions, use a voltage supervisor or a voltage monitor IC to monitor the input voltage. The IC can be programmed to shut down the module if the input voltage exceeds the recommended range.
  • The recommended output capacitor value is 10uF to 22uF, with a voltage rating of 12V or higher. A low-ESR ceramic capacitor, such as an X7R or X5R type, is recommended for optimal performance.

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RAC02-12SGB Overview

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