RAC20E-12SK/277 - RECOM Power

RAC20E-12SK/277 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance?
  RECOM Power Inc recommends a PCB layout with a large copper area for heat dissipation, and a thermal management system with a heat sink and thermal interface material to keep the junction temperature below 100°C.
• How do I ensure electromagnetic compatibility (EMC) with this module?
  To ensure EMC, RECOM Power Inc recommends following the layout and grounding guidelines in the datasheet, using a metal enclosure, and adding EMI filters and shielding as necessary to meet relevant standards such as EN 55022 and CISPR 22.
• What is the derating curve for this module, and how does it affect the output power?
  The derating curve for RAC20E-12SK/277 is typically provided in the datasheet or can be requested from RECOM Power Inc. It shows the reduction in output power as a function of temperature, and is used to ensure the module operates within its safe operating area.
• Can I use this module in a redundant or parallel configuration?
  Yes, the RAC20E-12SK/277 can be used in redundant or parallel configurations, but RECOM Power Inc recommends consulting with their application engineers to ensure proper design and implementation to avoid any potential issues.
• What are the reliability and MTBF (Mean Time Between Failures) data for this module?
  RECOM Power Inc provides reliability and MTBF data for the RAC20E-12SK/277 in the datasheet or upon request. The MTBF is typically calculated according to MIL-HDBK-217F or Telcordia SR-332, and is dependent on various factors such as operating conditions and temperature.