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RAVF164DJT1K00 - Stackpole Electronics, Inc.

Description: RES ARRAY, 1 Kohm, 5%, 0603x4, CONVEX

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PCB Footprints
RAVF164DJT1K00 - Stackpole Electronics, Inc. PCB footprint - Other - Other - RAVF164DJT1K00-2
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3D Models
RAVF164DJT1K00 - Stackpole Electronics, Inc.  - 3D model - Other - RAVF164DJT1K00-2
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RAVF164DJT1K00 Details

  • Manufacturer Part Number:

    RAVF164DJT1K00

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.20

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    8

  • Construction:

    Rectangular

  • Element Power Dissipation:

    0.1 W

  • First Element Resistance:

    1000 Ω

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1000 Ω

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Second/Last Element Resistance:

    1000 Ω

  • Size Code:

    0612

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    50 V

RAVF164DJT1K00 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RAVF164DJT1K00 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
  • The RAVF164DJT1K00 has a thermal resistance of 35°C/W. To handle thermal considerations, ensure good airflow around the component, use a heat sink if necessary, and avoid overheating the component.
  • The recommended soldering profile for the RAVF164DJT1K00 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C.
  • Yes, the RAVF164DJT1K00 is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and ensure proper mounting and securing of the component.
  • To ensure reliability in a humid environment, ensure the component is stored in a dry environment, use a conformal coating if necessary, and follow the manufacturer's guidelines for humidity testing.

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RAVF164DJT1K00 Overview

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