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RB068MM-30TR - ROHM Semiconductor

Description: Schottky Rectifier, 30 V, 2 A, Single, SOD-123FL, 2 Pins, 700 mV

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RB068MM-30TR - ROHM Semiconductor - PCB symbol
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RB068MM-30TR - ROHM Semiconductor PCB footprint - Other - Other - RB068MM-30TR
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RB068MM-30TR - ROHM Semiconductor - 3D model - Other - RB068MM-30TR
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RB068MM-30TR Details

  • Manufacturer Part Number:

    RB068MM-30TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PMDU, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2016-06-01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.1

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.7 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    0.8 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

RB068MM-30TR Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • ROHM recommends derating the power dissipation according to the temperature derating curve in the datasheet. Additionally, ensure good thermal design and consider using a heat sink if necessary.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time above 217°C of 30-60 seconds, and a total process time of 60-120 seconds.
  • Yes, the RB068MM-30TR is designed to withstand vibrations up to 10G. However, it's recommended to follow ROHM's guidelines for vibration testing and ensure proper PCB design and component mounting.
  • ROHM recommends following standard ESD handling procedures, such as using an ESD wrist strap, mat, or workstation, and ensuring that the component is stored in an ESD-protected package.

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RB068MM-30TR Overview

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