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RB068MM100TFTR - ROHM Semiconductor

Description: Super Low I<sub>R</sub>, 100V, 2A, SOD-123FL, Schottky Barrier Diode for Automotive

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RB068MM100TFTR - ROHM Semiconductor - PCB symbol
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PCB Footprints
RB068MM100TFTR - ROHM Semiconductor PCB footprint - Other - Other - RB068MM100TFTR-1
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RB068MM100TFTR - ROHM Semiconductor - 3D model - Other - RB068MM100TFTR-1
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RB068MM100TFTR Details

  • Manufacturer Part Number:

    RB068MM100TFTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-109B, 2PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.87 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    40 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    0.4 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

RB068MM100TFTR Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RB068MM100TFTR can be found in the ROHM Semiconductor's packaging specification document, which provides detailed information on the recommended pad layout and dimensions for optimal soldering and assembly.
  • The RB068MM100TFTR has a thermal resistance of 35°C/W, and it is recommended to use a heat sink or a thermal pad to dissipate heat. A thermal interface material (TIM) can also be used to improve heat transfer between the device and the heat sink.
  • The RB068MM100TFTR has an operating temperature range of -40°C to 150°C, but it is recommended to operate the device within a temperature range of -20°C to 125°C for optimal performance and reliability.
  • Yes, the RB068MM100TFTR is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the ROHM Semiconductor's application note. It is also recommended to use a solder with a melting point of 220°C or higher.

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RB068MM100TFTR Overview

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