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RB068VWM100TR - ROHM Semiconductor

Description: 100V, 2A, Single, PMDE, Ultra low I<sub>R</sub> SBD IFSM:25 A

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RB068VWM100TR - ROHM Semiconductor - PCB symbol
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PCB Footprints
RB068VWM100TR - ROHM Semiconductor PCB footprint - Other - Other - RB068VWM100TR
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RB068VWM100TR - ROHM Semiconductor - 3D model - Other - RB068VWM100TR
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RB068VWM100TR Details

  • Manufacturer Part Number:

    RB068VWM100TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.07

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.94 V

  • JESD-30 Code:

    R-PDSO-F2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    25 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    0.3 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RB068VWM100TR Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliability, follow the recommended derating curves for voltage and current, and ensure the device is operated within the specified temperature range. Also, consider using a heat sink or thermal interface material to reduce the junction temperature.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 4°C/s or less. Refer to the ROHM soldering guidelines for more information.
  • Yes, the RB068VWM100TR is designed to withstand vibrations up to 10G. However, it's recommended to follow proper mounting and soldering techniques to ensure the device is securely attached to the PCB.
  • ROHM recommends using an ESD protection device, such as a TVS diode, in parallel with the RB068VWM100TR. Additionally, follow proper ESD handling procedures during assembly and storage.

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RB068VWM100TR Overview

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