ROHM recommends a thermal pad size of at least 2mm x 2mm, with multiple vias connecting to a solid ground plane to ensure efficient heat dissipation. A minimum of 1oz copper thickness is also recommended.
To ensure reliable operation, ROHM recommends derating the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure proper thermal design, and consider using a heat sink or thermal interface material if necessary.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp-up rate of 3°C/s. Refer to the ROHM soldering guidelines for more detailed information.
The RB070MM-30TFTR is designed to withstand moderate vibration levels. However, for high-vibration environments, ROHM recommends using additional mechanical support, such as a bracket or adhesive, to ensure the component remains securely attached to the PCB.
ROHM recommends storing the RB070MM-30TFTR in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.
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