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RB085T-90 - ROHM Semiconductor

Description: ROHM RB085T-90, Dual Schottky Diode, Common Cathode, 90V 10A, 3-Pin TO-220

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PCB Footprints
RB085T-90 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO220FN_2021-1
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3D Models
RB085T-90 - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - TO220FN_2021-1
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RB085T-90 Details

  • Manufacturer Part Number:

    RB085T-90

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220FN, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.83 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    90 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RB085T-90 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the RB085T-90. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature, and ensure good airflow around the device.
  • ROHM recommends soldering the RB085T-90 using a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. The soldering iron temperature should not exceed 350°C (662°F) for 3 seconds. It's also essential to follow the recommended soldering profile and use a solder with a melting point above 217°C (423°F).
  • Yes, the RB085T-90 can be used in switching regulator applications. However, it's essential to ensure that the device is operated within its recommended switching frequency range (typically up to 500 kHz) and that the output voltage is properly filtered to minimize ringing and overshoot.
  • To protect the RB085T-90 from overvoltage and overcurrent conditions, consider using a voltage regulator with overvoltage protection (OVP) and overcurrent protection (OCP) features. Additionally, add a fuse or a current-limiting resistor in series with the device to prevent excessive current flow.

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