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RB088LAM100TR - ROHM Semiconductor

Description: Super Low I<sub>R</sub>, 100V, 5A, SOD-128, Schottky Barrier Diode

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RB088LAM100TR - ROHM Semiconductor - PCB symbol
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PCB Footprints
RB088LAM100TR - ROHM Semiconductor PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - RB088LAM100TRss
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3D Models
RB088LAM100TR - ROHM Semiconductor - 3D model - Small Outline Diode Flat Lead - RB088LAM100TRss
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RB088LAM100TR Details

  • Manufacturer Part Number:

    RB088LAM100TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.22

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.87 V

  • JESD-30 Code:

    R-PDSO-F2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    3 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RB088LAM100TR Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RB088LAM100TR can be found in the ROHM Semiconductor's packaging specification document, which provides detailed information on the recommended pad layout and dimensions for optimal assembly and reliability.
  • The RB088LAM100TR has a thermal resistance of 10°C/W, and it is recommended to use a thermal pad or a heat sink to dissipate heat. A thermal interface material (TIM) can also be used to improve heat transfer between the device and the heat sink.
  • The RB088LAM100TR has an operating temperature range of -40°C to 150°C, but it is recommended to operate the device within a temperature range of -20°C to 125°C for optimal performance and reliability.
  • To ensure the reliability of the RB088LAM100TR in high-humidity environments, it is recommended to use a moisture-resistant coating or conformal coating, and to follow proper storage and handling procedures to prevent moisture absorption.
  • The recommended soldering conditions for the RB088LAM100TR are a peak temperature of 260°C, a soldering time of 3 seconds, and a preheating temperature of 120°C to 150°C. It is also recommended to use a solder with a melting point of 217°C to 221°C.

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RB088LAM100TR Overview

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