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RB168LAM150TFTR - ROHM Semiconductor

Description: Super Low I<sub>R</sub>, 150V, 1A, SOD-128, Schottky Barrier Diode for Automotive

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RB168LAM150TFTR - ROHM Semiconductor PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-128 PMDTM
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3D Models
RB168LAM150TFTR - ROHM Semiconductor  - 3D model - Small Outline Diode Flat Lead - SOD-128 PMDTM
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RB168LAM150TFTR Details

  • Manufacturer Part Number:

    RB168LAM150TFTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-128, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.07

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.84 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    2.5 µA

  • Reverse Test Voltage:

    150 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RB168LAM150TFTR Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of at least 2.5mm x 2.5mm, with a minimum of 5 thermal vias (0.3mm diameter) connecting the pad to the bottom layer. This ensures efficient heat dissipation and minimizes thermal resistance.
  • To ensure reliable operation, ROHM recommends following the derating curves provided in the datasheet. Additionally, consider using a thermal management strategy, such as a heat sink or thermal interface material, to maintain a safe operating temperature.
  • ROHM recommends soldering at a peak temperature of 260°C (500°F) for 10-30 seconds, with a soldering iron temperature of 350°C (662°F). Avoid using excessive soldering temperatures or times to prevent damage to the component.
  • ROHM recommends storing the RB168LAM150TFTR in its original packaging, away from direct sunlight and moisture. Avoid bending, flexing, or applying excessive pressure to the component, as this can cause mechanical damage or electrical failure.
  • ROHM recommends following standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the component in an ESD-protected environment. The RB168LAM150TFTR has an ESD rating of 2kV (Human Body Model) and 150V (Machine Model).

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RB168LAM150TFTR Overview

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