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RB168MM-40TFTR - ROHM Semiconductor

Description: Super Low I<sub>R</sub>, 40V, 1A, SOD-123FL, Schottky Barrier Diode for Automotive

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RB168MM-40TFTR - ROHM Semiconductor - PCB symbol
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PCB Footprints
RB168MM-40TFTR - ROHM Semiconductor PCB footprint - Other - Other - RB168MM-40TFTR-1
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RB168MM-40TFTR - ROHM Semiconductor - 3D model - Other - RB168MM-40TFTR-1
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RB168MM-40TFTR Details

  • Manufacturer Part Number:

    RB168MM-40TFTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-109B, SOD-123FL, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    17 Weeks

  • Date Of Intro:

    2017-09-19

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.65 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    40 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    0.55 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

RB168MM-40TFTR Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material to improve heat transfer.
  • Handle the device by the body or pins, avoiding direct contact with the die. Use an anti-static wrist strap or mat, and store the device in an anti-static bag. Follow standard ESD handling procedures.
  • Yes, the RB168MM-40TFTR is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure that the device is used within the recommended operating conditions and that the PCB is designed to meet the required reliability standards.
  • Use a soldering iron with a temperature of 250°C to 260°C, and a soldering time of 3 to 5 seconds. Ensure that the device is not exposed to temperatures above 260°C for more than 10 seconds.

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RB168MM-40TFTR Overview

Use the download button to access the RB168MM-40TFTR schematic symbol, PCB footprint, and 3D model.
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