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RB168MM100TFTR - ROHM Semiconductor

Description: Super Low I<sub>R</sub>, 100V, 1A, SOD-123FL, Schottky Barrier Diode for Automotive

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RB168MM100TFTR - ROHM Semiconductor - PCB symbol
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RB168MM100TFTR - ROHM Semiconductor PCB footprint - Other - Other - PMDU_2022-3
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RB168MM100TFTR - ROHM Semiconductor - 3D model - Other - PMDU_2022-3
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RB168MM100TFTR Details

  • Manufacturer Part Number:

    RB168MM100TFTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-109B, SOD-123FL, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.81 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    40 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    0.4 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

RB168MM100TFTR Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RB168MM100TFTR can be found in the ROHM Semiconductor's packaging specification document or by contacting their technical support team. A general guideline is to follow the IPC-7351 standard for QFN packages.
  • The RB168MM100TFTR has a thermal pad on the bottom side, which should be connected to a thermal plane on the PCB to dissipate heat efficiently. A thermal via array or a copper pour with thermal vias can be used to improve heat dissipation.
  • The RB168MM100TFTR has an operating temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range. It's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance.
  • The RB168MM100TFTR is a surface-mount device and can be susceptible to vibration-induced solder joint failure. To ensure reliability in high-vibration environments, it's recommended to use a vibration-resistant solder alloy and follow proper PCB design and assembly guidelines.
  • To prevent EOS damage, ensure that the device is handled and stored in an electrostatic discharge (ESD)-protected environment. Use ESD-protective packaging and follow proper handling and assembly procedures to prevent damage from static electricity.

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RB168MM100TFTR Overview

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