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RB168MM100TR - ROHM Semiconductor

Description: Super Low I<sub>R</sub>, 100V, 1A, SOD-123FL, Schottky Barrier Diode

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RB168MM100TR - ROHM Semiconductor - PCB symbol
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PCB Footprints
RB168MM100TR - ROHM Semiconductor PCB footprint - Other - Other - RB168MM100TR-1
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3D Models
RB168MM100TR - ROHM Semiconductor - 3D model - Other - RB168MM100TR-1
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RB168MM100TR Details

  • Manufacturer Part Number:

    RB168MM100TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PMDU, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    17 Weeks

  • Date Of Intro:

    2016-06-01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.07

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

RB168MM100TR Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RB168MM100TR is a rectangle with a size of 2.5mm x 1.6mm, with a thermal pad size of 1.5mm x 1.1mm. The land pattern should be designed to ensure good thermal conductivity and mechanical stability.
  • To ensure proper thermal management, it is recommended to provide a thermal pad on the PCB, and to use a thermal interface material (TIM) between the device and the heat sink. The heat sink should be designed to provide good airflow and heat dissipation.
  • The maximum operating temperature range for the RB168MM100TR is -40°C to 150°C. However, the device can be operated at a maximum junction temperature of 175°C for a short period of time.
  • To ensure the reliability of the RB168MM100TR in high-humidity environments, it is recommended to use a moisture-resistant coating or conformal coating on the PCB, and to follow proper storage and handling procedures to prevent moisture absorption.
  • The RB168MM100TR has an ESD rating of 2kV human body model (HBM) and 150V machine model (MM). It is recommended to follow proper ESD handling and storage procedures to prevent damage to the device.

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RB168MM100TR Overview

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