ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a thermal via diameter of 0.3mm, and a minimum of 5 thermal vias. Additionally, a solid copper pour on the top and bottom layers can help improve thermal dissipation.
To ensure SOA, monitor the device's voltage, current, and power dissipation. Use the datasheet's SOA graph to determine the maximum allowable voltage and current for a given temperature. Implement overvoltage, overcurrent, and thermal protection mechanisms to prevent damage.
Store the RB168VWM100TFTR in a dry, cool place with a relative humidity of 60% or less. Avoid storing the device in direct sunlight or near heat sources. If the device is stored for an extended period, follow the recommended baking procedure to remove any absorbed moisture.
Yes, the RB168VWM100TFTR is suitable for high-reliability and automotive applications. ROHM offers a range of reliability tests and qualifications, including AEC-Q101, to ensure the device meets the required standards. However, it's essential to consult with ROHM or a qualified representative to discuss specific requirements and testing.
Handle the RB168VWM100TFTR with care, using anti-static wrist straps, mats, and packaging materials. Ensure that all equipment and tools used during assembly are ESD-protected. Follow proper grounding and electrostatic discharge prevention procedures to prevent damage.
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RB168VWM100TFTR Overview
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