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RB520CS30L,315 - Nexperia

Description: Schottky Diodes & Rectifiers REC 30V 1A 10pF

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Symbol
RB520CS30L,315 - Nexperia - PCB symbol
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PCB Footprints
RB520CS30L,315 - Nexperia PCB footprint - Other - Other - SOD882_
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3D Models
RB520CS30L,315 - Nexperia - 3D model - Other - SOD882_
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RB520CS30L,315 Details

  • Manufacturer Part Number:

    RB520CS30L,315

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    SOD-882, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD882

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    5

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.45 V

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    3 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.315 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    10 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

RB520CS30L,315 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the other layers. Additionally, keeping the thermal pad away from other components and ensuring good airflow around the device can help.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power handling capabilities. Additionally, using a heat sink or a thermal interface material can help to reduce the junction temperature.
  • The RB520CS30L,315 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. It's also recommended to use ESD protection devices on the input and output lines to prevent damage from external ESD events.
  • When selecting input and output capacitors, consider the device's operating frequency, voltage rating, and ripple current requirements. X7R or X5R ceramic capacitors are suitable for most applications, and it's recommended to use capacitors with a voltage rating of at least 1.5 times the maximum input voltage.
  • When assembling the RB520CS30L,315, ensure that the PCB is clean and dry, and that the device is handled by the edges to prevent damage. For rework, use a low-temperature soldering iron and a solder with a low melting point to avoid damaging the device.

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RB520CS30L,315 Overview

Use the download button to access the RB520CS30L,315 schematic symbol, PCB footprint, and 3D model.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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