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RB520SM-40T2R - ROHM Semiconductor

Description: 40V, 200mA, SOD-523, Schottky Barrier Diode

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RB520SM-40T2R - ROHM Semiconductor - PCB symbol
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PCB Footprints
RB520SM-40T2R - ROHM Semiconductor PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - EMD2
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3D Models
RB520SM-40T2R - ROHM Semiconductor - 3D model - Small Outline Diode Flat Lead - EMD2
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RB520SM-40T2R Details

  • Manufacturer Part Number:

    RB520SM-40T2R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-79, SOD-523, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.39 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RB520SM-40T2R Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. Ensure a minimum of 1mm clearance around the device for airflow.
  • Implement a heat sink or thermal interface material, and ensure good airflow around the device. Consider derating the device's power dissipation according to the ambient temperature.
  • Handle the device by the body, avoiding the leads. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow ESD precautions.
  • Yes, but ensure the device is securely mounted to the PCB using a suitable adhesive or mechanical fastening method. Consider adding vibration dampening materials or potting the device for added reliability.
  • Use a multimeter to check for voltage, current, and resistance anomalies. Verify the device's pinout and connections. Consult the datasheet and application notes for troubleshooting guidelines.

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RB520SM-40T2R Overview

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