A thermal pad is recommended under the IC to improve heat dissipation. A 2-layer or 4-layer PCB with a solid ground plane and thermal vias can help reduce thermal resistance.
Use a high-quality output capacitor with low ESR, and ensure the input capacitor is rated for the input voltage. Also, minimize the distance between the IC and the output capacitor to reduce noise.
Although the datasheet specifies a maximum input voltage of 18V, it's recommended to limit the input voltage to 15V to ensure reliable operation and prevent damage to the IC.
While the RB731UT108 is rated for operation up to 105°C, it's essential to consider the derating curves and thermal management to ensure reliable operation in high-temperature environments.
Use a shielded inductor, keep the switching node (SW) as short as possible, and ensure good PCB layout practices, such as separating the power and ground planes.
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RB731UT108 Overview
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