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RB751CS40,315 - Nexperia

Description: NEXPERIA - RB751CS40,315 - Small Signal Schottky Diode, Single, 40 V, 120 mA, 370 mV, 200 mA, 150 °C

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RB751CS40,315 - Nexperia PCB footprint - Other - Other - RB751CS40,315-2
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RB751CS40,315 - Nexperia  - 3D model - Other - RB751CS40,315-2
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RB751CS40,315 Details

  • Manufacturer Part Number:

    RB751CS40,315

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    SOD-882, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD882

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.37 V

  • JESD-30 Code:

    R-PDSO-N2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.2 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.12 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

RB751CS40,315 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the other side of the board. Additionally, keeping the component away from other heat sources and using a heat sink can also improve thermal performance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink, and ensure good airflow around the component. It's also crucial to follow proper PCB design and layout guidelines to minimize thermal resistance.
  • The RB751CS40,315 has built-in ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent ESD damage. Use an ESD wrist strap or mat, and ensure that the device is stored in an anti-static bag or container. During PCB assembly, use ESD-safe tools and materials, and consider adding additional ESD protection components if necessary.
  • When selecting an input capacitor for the RB751CS40,315, consider the following factors: voltage rating, capacitance value, and ESR (Equivalent Series Resistance). A general rule of thumb is to choose a capacitor with a voltage rating at least 1.5 times the maximum input voltage, and a capacitance value between 1-10 μF. The ESR should be as low as possible to minimize energy losses.
  • When designing the PCB layout and routing for the RB751CS40,315, consider the following: keep the input and output traces as short as possible, use a solid ground plane, and avoid routing sensitive signals near the device. Additionally, ensure that the thermal pad is connected to a large copper area to facilitate heat dissipation.

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RB751CS40,315 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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