RBR1VWM60ATFTR - ROHM Semiconductor

RBR1VWM60ATFTR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a minimum of 10 thermal vias (0.3mm diameter) to ensure optimal heat dissipation. Additionally, a solid copper plane on the bottom layer can help to further reduce thermal resistance.
• How do I ensure the device is properly soldered?
  ROHM recommends using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds. The device should be placed on a flat, even surface, and the solder paste should be applied evenly to prevent bridging or voids.
• What is the maximum allowed voltage derating for this device?
  ROHM recommends derating the voltage by 10% to ensure reliable operation. For example, if the maximum rated voltage is 60V, the derated voltage would be 54V.
• How do I handle ESD protection for this device?
  ROHM recommends using an ESD protection device, such as a TVS diode, in parallel with the RBR1VWM60ATFTR to protect against electrostatic discharge. The ESD protection device should be rated for the same voltage and current as the RBR1VWM60ATFTR.
• What is the recommended storage condition for this device?
  ROHM recommends storing the RBR1VWM60ATFTR in a dry, cool place (temperature range: 5°C to 30°C, humidity: 60% or less) to prevent moisture absorption and damage.