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RBR40NS30AFHTL - ROHM Semiconductor

Description: Low VF, 30V, 40A, TO-263S (D2PAK), Schottky Barrier Diode for Automotive

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RBR40NS30AFHTL - ROHM Semiconductor PCB footprint - Other - Other - LPDS_Master
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3D Models
RBR40NS30AFHTL - ROHM Semiconductor  - 3D model - Other - LPDS_Master
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RBR40NS30AFHTL Details

  • Manufacturer Part Number:

    RBR40NS30AFHTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-83, TO-263S, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.32

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.52 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    600 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RBR40NS30AFHTL Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the RBR40NS30AFHTL is -40°C to 150°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade if operated outside this range for extended periods.
  • To ensure proper soldering, follow the recommended soldering conditions and guidelines provided in the datasheet. Use a soldering iron with a temperature range of 350°C to 370°C, and apply a soldering flux suitable for lead-free soldering. Additionally, ensure the PCB is designed with adequate thermal relief and clearance to prevent overheating during soldering.
  • The maximum allowable power dissipation for the RBR40NS30AFHTL is dependent on the operating temperature and the thermal resistance of the device. According to the datasheet, the maximum power dissipation is 40W at a junction temperature of 25°C. However, it's crucial to perform thermal calculations and consider the specific application's requirements to ensure the device operates within safe limits.
  • While the RBR40NS30AFHTL is a high-speed switching device, its performance at high frequencies (above 100 kHz) may be affected by factors such as parasitic capacitance, inductance, and resistance. To ensure reliable operation, it's recommended to consult the datasheet and application notes for guidance on high-frequency operation, and to perform thorough simulations and testing to validate the design.
  • To prevent electrostatic discharge (ESD) damage, follow proper handling and storage procedures for the RBR40NS30AFHTL. Use an ESD-protected workstation, wear an ESD strap or wristband, and handle the device by the body or pins, rather than the leads. Additionally, ensure the PCB design includes adequate ESD protection circuitry, such as TVS diodes or ESD protection arrays.

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RBR40NS30AFHTL Overview

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