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RC1005F100CS - SAMSUNG

Description: Res Thick Film 0402 10 Ohm 1% 0.063W(1/16W) ±100ppm/°C Pad SMD T/R

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RC1005F100CS - SAMSUNG PCB footprint - Resistor Chip - Resistor Chip - RC1005
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RC1005F100CS - SAMSUNG  - 3D model - Resistor Chip - RC1005
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RC1005F100CS Details

  • Manufacturer Part Number:

    RC1005F100CS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Philippines, South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    45 Weeks

  • Manufacturer:

    Samsung Electro-Mechanics

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.35 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.0625 W

  • Rated Temperature:

    70 °C

  • Resistance:

    10 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

RC1005F100CS Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RC1005F100CS is a rectangular pad with a size of 1.3mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape.
  • The RC1005F100CS has a thermal resistance of 350°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
  • The maximum power rating for the RC1005F100CS is 0.1W. Ensure that the component is not subjected to power exceeding this rating to avoid damage or failure.
  • To ensure reliability in high-humidity environments, use a moisture-resistant coating or conformal coating on the PCB, and follow proper storage and handling procedures to prevent moisture absorption.
  • The recommended soldering profile for the RC1005F100CS is a peak temperature of 260°C, with a soldering time of 3-5 seconds. Ensure that the soldering process is within the specified temperature range to avoid damage to the component.

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RC1005F100CS Overview

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Part Image RK73H1ERTTPS10R0F KOA Speer Electronics Inc

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For a full list of alternate parts for RC1005F100CS, check out Findchips.com