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RC1005F331CS - SAMSUNG

Description: RES SMD 330 OHM 1% 1/16W 0402

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Symbol
RC1005F331CS - SAMSUNG - PCB symbol
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PCB Footprints
RC1005F331CS - SAMSUNG PCB footprint - Resistor Chip - Resistor Chip - RC0402(01005)
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3D Models
RC1005F331CS - SAMSUNG - 3D model - Resistor Chip - RC0402(01005)
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RC1005F331CS Details

  • Manufacturer Part Number:

    RC1005F331CS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Philippines, South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    45 Weeks

  • Manufacturer:

    Samsung Electro-Mechanics

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.35 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.0625 W

  • Rated Temperature:

    70 °C

  • Resistance:

    330 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

RC1005F331CS Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RC1005F331CS is a rectangular pad with a size of 1.3mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape.
  • The RC1005F331CS has a thermal resistance of 350°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
  • The maximum power rating for the RC1005F331CS is 0.125W. Ensure that the component is not subjected to power exceeding this rating to avoid damage or failure.
  • Yes, the RC1005F331CS is suitable for high-frequency applications up to 1 GHz. However, ensure that the component is properly decoupled and that the PCB layout is optimized for high-frequency performance.
  • Store the RC1005F331CS in a dry, cool place, away from direct sunlight and moisture. Handle the component by the edges to prevent electrostatic discharge (ESD) damage, and use anti-static packaging and handling materials.

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RC1005F331CS Overview

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Part Image MCR01PZPIF3300 ROHM Semiconductor

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For a full list of alternate parts for RC1005F331CS, check out Findchips.com