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RC1608F204CS - SAMSUNG

Description: 200 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Moisture Resistant Thick Film

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RC1608F204CS - SAMSUNG - PCB symbol
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PCB Footprints
RC1608F204CS - SAMSUNG PCB footprint - Resistor Chip - Resistor Chip - SIZE CODE 1608
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3D Models
RC1608F204CS - SAMSUNG - 3D model - Resistor Chip - SIZE CODE 1608
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RC1608F204CS Details

  • Manufacturer Part Number:

    RC1608F204CS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Philippines, South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    45 Weeks

  • Manufacturer:

    Samsung Electro-Mechanics

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    200000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

RC1608F204CS Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RC1608F204CS is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder resist opening of 0.5mm x 0.5mm.
  • The RC1608F204CS has a thermal resistance of 150°C/W. To handle thermal considerations, ensure good airflow around the component, use a thermal pad or heat sink if necessary, and avoid overheating the component during soldering or operation.
  • The recommended soldering profile for the RC1608F204CS is a peak temperature of 240°C, with a dwell time of 30-60 seconds above 217°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, the RC1608F204CS is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and ensure proper mounting and soldering to prevent component failure.
  • To ensure reliability in a humid environment, ensure the component is stored in a dry environment before assembly, use a moisture-resistant coating or conformal coating, and follow the manufacturer's guidelines for humidity testing.

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RC1608F204CS Overview

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RC1608F204CS Alternates

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Part Image HFPF03FV-204-M Hitano Enterprise Corp

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Part Image 0603WGF2003CCE Royal Electronic Factory (Thailand) Co Ltd

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For a full list of alternate parts for RC1608F204CS, check out Findchips.com