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RC2012F101CS - SAMSUNG

Description: Res Thick Film 0805 100 Ohm 1% 0.125W(1/8W) ±100ppm/C Pad SMD T/R

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RC2012F101CS - SAMSUNG PCB footprint - Resistor Chip - Resistor Chip - RC2012
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RC2012F101CS - SAMSUNG  - 3D model - Resistor Chip - RC2012
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RC2012F101CS Details

  • Manufacturer Part Number:

    RC2012F101CS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Philippines, South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    45 Weeks

  • Manufacturer:

    Samsung Electro-Mechanics

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Resistance:

    100 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

RC2012F101CS Frequently Asked Questions (FAQs)

  • The recommended soldering temperature is between 250°C to 260°C for a maximum of 3 seconds.
  • Yes, the RC2012F101CS is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency.
  • The RC2012F101CS is rated for operation up to 125°C, but its capacitance value may decrease by up to 20% at high temperatures. Consult the datasheet for detailed temperature derating information.
  • Yes, the RC2012F101CS is compatible with lead-free soldering processes and meets the requirements of the RoHS directive.
  • The recommended land pattern for the RC2012F101CS is a rectangular pad with a minimum size of 1.5 mm x 3.2 mm, with a non-solder mask defined (NSMD) pad shape.

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RC2012F101CS Overview

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