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RC2012J000CS - SAMSUNG

Description: Res Thick Film 0805 0 Ohm Pad SMD T/R

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RC2012J000CS - SAMSUNG PCB footprint - Resistor Chip - Resistor Chip - RC2012(0805)
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RC2012J000CS - SAMSUNG  - 3D model - Resistor Chip - RC2012(0805)
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RC2012J000CS Details

  • Manufacturer Part Number:

    RC2012J000CS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Philippines, South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    45 Weeks

  • Manufacturer:

    Samsung Electro-Mechanics

  • YTEOL:

    11

  • Additional Feature:

    RATED CURRENT: 2A

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, 7 INCH

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Resistor Type:

    JUMPER

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

RC2012J000CS Frequently Asked Questions (FAQs)

  • The recommended soldering temperature is between 250°C to 260°C for a maximum of 3 seconds.
  • Yes, the RC2012J000CS is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency.
  • The RC2012J000CS is rated for operation up to 125°C, but its capacitance value may decrease by up to 20% at high temperatures. Consult the datasheet for detailed temperature characteristics.
  • Yes, the RC2012J000CS is compatible with lead-free soldering processes and meets the requirements of the RoHS directive.
  • The recommended land pattern for the RC2012J000CS is a rectangular pad with a minimum size of 1.5 mm x 3.5 mm, with a non-solder mask defined (NSMD) pad shape.

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RC2012J000CS Overview

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Part Image CRCW08050000Z0TBBC Vishay Intertechnologies

Metal Glaze/thick Film, 0.125W, 0ohm, Surface Mount, 0805

Part Image RTT050000FP3 Ralec

Metal Glaze/thick Film, 0.125W, 0ohm, Surface Mount, 0805

Part Image RC2012J000FS Samsung Electro-Mechanics

Metal Glaze/thick Film, 0.125W, 0ohm, Surface Mount, 0805

Part Image 9C08052A0R00JKPFT YAGEO Corporation

Metal Glaze/thick Film, 0.125W, 0ohm, Surface Mount, 0805

Part Image 9C08052A0R00JLPF4 YAGEO Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 0ohm, Surface Mount, 0805, CHIP, HALOGEN FREE AND ROHS COMPLIANT

For a full list of alternate parts for RC2012J000CS, check out Findchips.com