1.60 X 1.60 MM, 0.60 MM HEIGHT, ROHS COMPLIANT, SLP, 6 PIN
Pin Count:
6
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.50
Factory Lead Time:
13 Weeks
Manufacturer:
Semtech Corporation
YTEOL:
3
Breakdown Voltage-Min:
6 V
Clamping Voltage-Max:
25 V
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code:
R-XDSO-N6
JESD-609 Code:
e4
Moisture Sensitivity Level:
1
Non-rep Peak Rev Power Dis-Max:
150 W
Number of Elements:
1
Number of Terminals:
6
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
UNSPECIFIED
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity:
UNIDIRECTIONAL
Qualification Status:
Not Qualified
Reference Standard:
IEC-61000-4-2, 4-4
Rep Pk Reverse Voltage-Max:
5 V
Surface Mount:
YES
Technology:
AVALANCHE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
NO LEAD
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
RCLAMP0504P.TCT Frequently Asked Questions (FAQs)
A good PCB layout for the RCLAMP0504P.TCT involves keeping the device close to the protected circuit, using short traces, and minimizing the inductance of the PCB traces. A ground plane under the device can also help to reduce noise and improve performance.
The value of the external capacitor (C1) depends on the specific application and the desired level of ESD protection. A general guideline is to use a capacitor with a value between 1nF to 10nF. A larger capacitor value can provide better ESD protection but may affect the signal integrity.
The RCLAMP0504P.TCT is rated for operation over a temperature range of -40°C to +125°C. However, the device's performance and reliability may degrade at extreme temperatures, so it's essential to consider the specific application's temperature requirements.
Yes, the RCLAMP0504P.TCT is suitable for protecting high-speed data lines, such as USB, HDMI, and Ethernet. However, it's essential to consider the signal integrity and ensure that the device does not affect the signal quality or introduce significant latency.
To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point below 260°C. Apply a small amount of solder paste to the PCB pads, and use a reflow oven or a hot air gun to solder the device. Avoid overheating the device or the PCB.
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RCLAMP0504P.TCT Overview
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